Page 4 of 4
Re: AP30
Posted: Mon Feb 22, 2021 11:50 am
by savvypaul
Hannes-Gregor wrote: ↑Mon Feb 22, 2021 11:10 am
savvypaul wrote: ↑Mon Feb 22, 2021 10:52 am
Hannes-Gregor wrote: ↑Mon Feb 22, 2021 9:08 am
But if it works, it works? Or did I built a time bomb?
It depends.
Most of the components on the board are designed to heat up, within an optimum temperature range, during operation. If you cover a component with only 2mm clearance, and that component is designed to heat up, it's very likely that it will start heating up beyond it's optimum temperature range.
If you only cover components that are not designed to heat up, then you're fine. If you send photos to Tomasz, he will see if he can tell exactly what you have covered.
Thank you, Paul. I think there is no need to disturb Tomasz with this question. After having another look at it, only about 3 mm of the pot cover the board, no components are affected. Only the connecting link between in- and output stage is covered.
That sounds absolutely fine, then.
Re: AP30
Posted: Mon Feb 22, 2021 12:21 pm
by Hannes-Gregor
savvypaul wrote: ↑Mon Feb 22, 2021 11:50 am
Hannes-Gregor wrote: ↑Mon Feb 22, 2021 11:10 am
savvypaul wrote: ↑Mon Feb 22, 2021 10:52 am
It depends.
Most of the components on the board are designed to heat up, within an optimum temperature range, during operation. If you cover a component with only 2mm clearance, and that component is designed to heat up, it's very likely that it will start heating up beyond it's optimum temperature range.
If you only cover components that are not designed to heat up, then you're fine. If you send photos to Tomasz, he will see if he can tell exactly what you have covered.
Thank you, Paul. I think there is no need to disturb Tomasz with this question. After having another look at it, only about 3 mm of the pot cover the board, no components are affected. Only the connecting link between in- and output stage is covered.
That sounds absolutely fine, then.
That's what I wanted to hear, thank you.